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Dublin, May 27, 2021/PRNewswire/ - The "CMP Equipment and Consumables: Market Analysis and Forecast" report from The Information Network has been added to ResearchAndMarkets.com's products.

This report studies and predicts the technologies involved in the chemical mechanical planarization of semiconductor layers. This report discusses technology trends, products, applications, and suppliers of materials and equipment. Proposed market forecasts for CMP equipment and materials.

Chemical mechanical planarization (CMP) is a key production step in the microcircuit manufacturing process. The smaller the electronic components, the more complicated the CMP process. The customer's goal is to obtain flat, smooth, and polished wafers. CMP is a basic technology for local and global planarization of dielectric interlayers, polished copper damascene structures, tungsten vias, low-k dielectric films, and shallow trench isolation. The ever-increasing list of semiconductor devices and large-scale requirements require simultaneous or sequential polishing of multiple materials, which increases the complexity of CMP and continuously requires optimization of process design and control. CMP pads and slurries are used to chemically and mechanically level the surface of a wafer. Semiconductor wafers usually have multiple layers deposited on top of another. When the layers are put down, they must be polished flat before adding the next layer of circuit components (because more information can be packaged on a flat chip).

This is achieved through the CMP process, which uses a CMP pad and slurry-the pad is made of resin and placed on a rotating platen. CMP slurry refers to the chemical substance that is distributed between the pad and the wafer during this process. Main topics covered: Chapter 1 Introduction Chapter 2 Executive Summary 2.1 Introduction 2.2 Market Opportunities Chapter 3 Planarization Methods 3.1 Demand for Planarization 3.1.1 Lithography 3.1.2 Deposition 3.1.3 Etching 3.2 Application 3.2.1 Dielectric 3.2 .2 Metal Planarization Technology 3.33 Planarization Technology 3.33.1 Local Planarization 3.3.2 Global Planarization 3.4 CMP 3.4.1 Background 3.4.2 Research Work 3.4.3 Advantages and Disadvantages 3.4.4 Process Parameters 3.4.5 Device Process Parameters Section Chapter 4 CMP Consumables 4.1 Slurry 4.2 Post-CMP Polishing and Cleaning 4.3 Chapter 5 CMP Equipment 5.1 Single-head Method 5.1.1 Advantages 5.1.2 Disadvantages 5.2 Multi-head Method 5.2.1 Advantages 5.2.2 Disadvantages 5.3 Equipment Introduction 5.3.1 Application Materials 5.3 .2 Ebara 5.3.3. KC Tech 4 Accretech 5.3.5 Revasum Chapter 6 User Issues 6.1 Cost of Ownership 6.2 User Requirements 6.3 Benchmarking Suppliers 6.4 User-Supplier Synergy 6.5 Reliability 6.6 Equipment Maintainability Chapter 7 Chapter Market Information recast For more information on this report, please visit https://www.researchandmarkets.com/r/3084jk

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